Recommended operating conditions

nPM6001 Product Specification

The operating conditions are the physical parameters that the chip can operate within.

Table 1. Supply voltages and temperature ranges
Symbol	Parameter	Min.	Nom.	Max.	Unit
VIN	Supply voltage VIN, VIN_ANA, VIN_BUCK0, VIN_BUCK1, VIN_BUCK2, VIN_BUCK3, VIN_LDO0, VIN_LDO1, VIN_GPIO The voltage levels for above pins must be within 100 mV from each other (including transients)	3.0		5.5	V
VO0_IN	nINT and READY supply voltage	1.71		3.6	V
VDD_TWI	TWI supply voltage VDD_TWI ≤ VIN	1.65		3.6	V
VO2	Supply voltage, custom configuration (BUCK2 unpopulated) VO2 ≤ VDD_TWI	1.14		3.6	V
VIN_RAMP	VIN supply ramp rate (R_SOURCE < 0.5 Ohm)	1			V/ms
T_J	Junction temperature	−40	25	125	°C
T_OJ	Operating junction temperature	−40	25	105	°C

Table 2. I/O voltage
Pin	Parameter	Min.	Nom.	Max.	Unit
ENABLE		0		VIN	V
GPIO0, GPIO1, GPIO2	CMOS mode	0		VIN	V
GPIO0, GPIO1, GPIO2	Schmitt trigger mode	0		VO2	V
BUCK_MODE0, BUCK_MODE1, BUCK_MODE2	CMOS mode	0		VIN	V
BUCK_MODE0, BUCK_MODE1, BUCK_MODE2	Schmitt trigger mode	0		VO2	V
READY, nINT		0		VO0	V
SCL, SDA		0		VDD_TWI	V

Table 3. Dissipation ratings (JESD51-7)
Symbol	Parameter	Nom.	Unit
R_ϴJA	Junction-to-ambient thermal resistance	42	°C/W
R_ϴJC(top)	Junction-to-case (top) thermal resistance	2	°C/W
R_ϴJB	Junction-to-board thermal resistance	15.5	°C/W
Ψ_JT	Junction-to-top characterization parameter	3.3	°C/W
Ψ_JB	Junction-to-board characterization parameter	16	°C/W

WLCSP light sensitivity

WLCSP package is sensitive to visible and near infrared light, which means that a final product design must shield the chip properly.