S140 SoftDevice v7.3.0
Keys that can be exchanged during a bonding procedure. More...
#include <ble_gap.h>
Detailed Description
Keys that can be exchanged during a bonding procedure.
Field Documentation
| uint8_t ble_gap_sec_kdist_t::enc |
Long Term Key and Master Identification.
| uint8_t ble_gap_sec_kdist_t::id |
Identity Resolving Key and Identity Address Information.
| uint8_t ble_gap_sec_kdist_t::link |
Derive the Link Key from the LTK.
| uint8_t ble_gap_sec_kdist_t::sign |
Connection Signature Resolving Key.