ble_gap_sec_kdist_t

S122 SoftDevice v8.0.0 API

Keys that can be exchanged during a bonding procedure. More...

#include <ble_gap.h>

Data Fields

uint8_t enc : 1
uint8_t id : 1
uint8_t sign : 1
uint8_t link : 1

Detailed Description

Keys that can be exchanged during a bonding procedure.

Field Documentation

uint8_t ble_gap_sec_kdist_t::enc

Long Term Key and Master Identification.

uint8_t ble_gap_sec_kdist_t::id

Identity Resolving Key and Identity Address Information.

uint8_t ble_gap_sec_kdist_t::link

Derive the Link Key from the LTK.

uint8_t ble_gap_sec_kdist_t::sign

Connection Signature Resolving Key.