nRF93M1 is delivered in a sealed dry pack and follows standard JEDEC handling guidelines for surface-mount LGA modules.
Follow these guidelines when integrating nRF93M1 on the host PCB:
- Storage – keep modules in the sealed dry pack at ≤30 °C/60% RH until ready for assembly.
- Floor life – once the dry pack is opened, complete reflow within 168 hours at ≤30°C/60% RH (MSL 3).
- Baking – if floor life or storage conditions are exceeded, bake per JEDEC J-STD-033 before reflow.
- Reflow profile – use a profile compatible with IPC-7530, peak 240°C ±5 °C, max 3 reflow cycles.
- RESERVED pins – connect thermally and mechanically to the host PCB but leave electrically unconnected.
- Antenna routing – route the ANT pin with a controlled-impedance 50 Ω transmission line; keep the line short and clear of digital aggressors.
- VDD decoupling – place bulk + high-frequency decoupling capacitors close to the VDD pins per the Hardware Design Guidelines.
- ESD handling – observe ESD-protected handling per JESD625 (Class 1C HBM, Class C1 CDM).
For more detailed instructions related to assembly, see nRF93M1 Hardware Design Guidelines.