Module-level thermal-resistance and temperature-monitoring data.
Operating temperature range
nRF93M1 operates over an ambient temperature range of −35 °C to +75 °C. Module-level derating (if any) is given in the Recommended Operating Conditions chapter.
Thermal resistance
| Parameter | Value | Unit |
|---|---|---|
| Junction-to-ambient thermal resistance, θJA | TBD | °C/W |
| Junction-to-case thermal resistance, θJC | TBD | °C/W |
| Junction-to-top characterization parameter, ΨJT | TBD | °C/W |
| Junction-to-board characterization parameter, ΨJB | TBD | °C/W |
Measurements follow JEDEC standards JESD51-2 (θJA, ΨJT) and JESD51-8 (θJC) on a 2s2p test board.
On-chip temperature monitor
The host application can read the on-chip temperature through the proprietary
AT%ADC command.
Host PCB guidance
For reliable operation at elevated ambient temperature:
- Use a thermal-relief-free copper pour under the module footprint on the host PCB to improve heat spreading.
- Add thermal vias beneath the module when the host PCB uses inner ground planes.
- Avoid placing heat-generating components (high-current regulators, RF power amplifiers, or CPU) directly adjacent to the nRF93M1.