Circuit configuration 1 for QFN48 (QFAA)

nRF54L15 | nRF54L10 | nRF54L05 Datasheet

Table 1. Circuit configurations
Config no. Supply configuration Enabled features
VDD NFC
Config 1 DCDC: supplied by battery or external supply No
Figure 1. Circuit configuration 1 schematic
P1.11 P1.12 P1.00/XL1 P1.01/XL2 XC1 XC2 P1.03/NFC2 VDD_nRF P1.02/NFC1 P1.08 P1.04/AIN0 P1.05/AIN1 P1.06/AIN2 P1.07/AIN3 P2.00 P2.01 P2.02 P2.03 P2.04 P2.05 P2.06 P2.07 P2.08 P2.09 P2.10 P0.00 P0.01 P0.02 P0.03 P0.04 P1.13 P1.14 P1.09 P1.10 RF 0201 C4 100nF 0201 C7 100nF 0201 C8 100nF 0201 FB1 0201 C1 2.2µF 0201 C2 2.2µF Optional 0201 C10 100nF 0201 C12 10nF DECA 0603 L1 4.7µH XTAL_2012 X1 32.768kHz XTAL_2016 X2 32MHz DECD DCC L2: LQP03HQ2N7B02 L3: LQP03HQ3N5B02 L4: = L3 C6: GJM0335C1E1R5WB01 C9: GJM0335C1E2R0WB01 SWDCLK SWDIO NRESET 0201 R1 1k 0201 C5 2.2nF 0402 C3 10µF 0201 L3 3.5nH 0201 C11 0.3pF 0201 L2 2.7nH 0201 C6 1.5pF 0201 C9 2.0pF 0201 L4 3.5nH 0201 C13 3.9pF VSS_PA 32 ANT 31 DECRF 33 XC1 34 XC2 35 VDD 36 VDD 10 SWDIO 25 VDD 22 DECA 43 DECD 45 VSS 44 VDD 48 DCC 46 SWDCLK 26 RESET 30 VSS 49 VDD 47 U1A nRF 54L15-QFAA P0.02 27 P0.03/CK 28 P0.04/CK 29 P0.00 23 P0.01 24 U1B nRF54L15-QFAA P1.00/XL1 1 P1.08/EXTREF/CLK16M/CK 9 P1.01/XL2 2 P1.02/NFC1 3 P1.03/NFC2/CK 4 P1.04/AIN0/CK 5 P1.05/AIN1 6 P1.06/AIN2 7 P1.07/AIN3 8 P1.10 38 P1.11/AIN4/CK 39 P1.12/AIN5/CK 40 P1.13/AIN6 41 P1.14/AIN7 42 P1.09 37 U1C nRF54L15-QFAA P2.00 11 P2.01/CK 12 P2.02 13 P2.03 14 P2.04 15 P2.05 16 P2.06/CK 17 P2.07/SWO 18 P2.08 19 P2.09 20 P2.10 21 U1D nRF54L15-QFAA Important note on C6: - Grounding of C6 capacitor must ONLY be connected to Pin32 (VSS_PA) in top layer. - Pin32 must ONLY be connected to Pin49 (VSS center pad) underneath the IC package Important note on C9: - Grounding of C9 capacitor MUST be isolated from ALL ground layers except the bottom ground layer.
Note: For PCB reference layouts, see the product page for the device on www.nordicsemi.com.
Table 2. Bill of material for circuit configuration 1
Designator Value Description Footprint
C1, C2 2.2 µF Capacitor, X6T, ±20%, 2.5 V 0201
C3 10 µF Capacitor, X6S, ±20%, 6.3 V 0402
C4, C7, C8, C10 100 nF Capacitor, X7R, ±10% 0201
C5 2.2 nF Capacitor, X7R, ±10%, 10V 0201
C6 1.5 pF Capacitor, NP0, ±0.05 pF, 25 V, High Q 0201
C9 2.0 pF Capacitor, NP0, ±0.05 pF, 25 V 0201
C11 0.3 pF Capacitor, C0G, ±0.1 pF, 50 V 0201
C12 10 nF Capacitor, X7R, 6.3 V 0201
C13 3.9 pF Capacitor, C0G, ±0.25 pF, 50 V 0201
FB1 120 Ω Ferrite bead, 120 Ω at 100 MHz, 200 mA, 500 mΩ Max 0201
L1 4.7 µH Inductor, 120 mA, ±20%, 650 mΩ 0603
L2 2.7 nH Inductor, 600 mA, ±0.1 nH, 120 mΩ 0201
L3, L4 3.5 nH Inductor, 500 mA, ±0.1 nH, 170 mΩ 0201
R1 1 kΩ Resistor, ±1%, 0.05 W 0201
U1 nRF54L15-QFAA Multiprotocol Bluetooth® Low Energy, IEEE 802.15.4, and 2.4GHz proprietary System on Chip QFN-48
X1 32.768 kHz Crystal SMD 2012, 32.768 kHz, Cl = 9 pF, Total tol: ±20 ppm XTAL_2012
X2 32 MHz Crystal SMD 2016, 32 MHz, Cl = 8 pF, Total Tol: ±40 ppm. For frequency tolerance requirements, see 32 MHz crystal oscillator (HFXO). XTAL_2016
Note: The antenna filtering components are subject to change.