Package thermal characteristics

A summary of the thermal characteristics for the different packages available for the device can be found below.

Table 1. Package thermal characteristics

Symbol	Package	Typ.	Unit
θJA,QFN48	QFN48	24.86	°C/W
θJC,QFN48	QFN48	12.71	°C/W
θJA,CSP47	CSP47	83.84	°C/W
θJC,CSP47	CSP47	7.82	°C/W

Values for θ_JA are obtained by simulation following the EIA/JESD51-2 for still air condition using JEDEC PCB.

Values for θ_JC are obtained by simulation. A cold plate and the grease between package and cold plate are modeled.